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- PowerArtistRTL Power Reduction, Analysis, Debug, and RPM Generation
- RedHawkSoC Dynamic Power, Advanced Low Power, Reliability, and Chip-Package Co-design
- TotemAnalog/Mixed-Signal Dynamic Power, Substrate Noise, EM, and ESD
- SentinelChip-Package-System Power/Signal Integrity, IO-SSO, Thermal, and EMI
- ResourcesTechnical Papers and Presentations, Contributed Articles and Conference Papers, Webinars and Videos
- フロー
- Ultra Low PowerPower methodology for ultra-low-power designs
- IP IntegrationPower methodology for IP Integration initiative
- Chip-Package-SystemPower methodology for giga-hertz performance
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Unavoidable Design Challenges
Designing a successful electronic system that can meet the needs of the quickly evolving smart electroncis market requires design teams to solve critical problems such as power efficiency, unrealistic schedules, and cost-down considerations.
ACM/IEEE A. R. Newton Technical Impact Award in Electronic Design Automation
Apache Engineer honored with award for co-authored paper - FastCap: a multipole accelerated 3-D capacitance extraction program
RTL Design-for-Power for Mobile SoCs: Best Practices - Educast
Learn Register Transfer Language (RTL) best practices for low-power mobile semiconductor design
SoC Power Integrity Challenges - Educast
ICs must deliver increased performance and functionality while simultaneously lowering power budgets
Chip-Package-System ESD Simulation
ESD simulation enables system-wide ESD robustness validation, a common challenge in automotive and aerospace applications
最新情報
Jun
7
Unavoidable Design Challenges - Chip Design
May
30
Si2 Announces New Power Distribution Network Standard for 3D ... - EDACafe
May
28
SemiWiki Top 10 Must See @ #50DAC List! - SemiWiki.com
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注目情報
Chip-Package-System (CPS) Solutions Microsite - Learn More
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