- 製品
- PowerArtistRTL Power Reduction, Analysis, Debug, and RPM Generation
- RedHawkSoC Dynamic Power, Advanced Low Power, Reliability, and Chip-Package Co-design
- TotemAnalog/Mixed-Signal Dynamic Power, Substrate Noise, EM, and ESD
- SentinelChip-Package-System Power/Signal Integrity, IO-SSO, Thermal, and EMI
- ResourcesProduct Whitepapers
- フロー
- Ultra Low PowerPower methodology for ultra-low-power designs
- IP IntegrationPower methodology for IP Integration initiative
- Chip-Package-SystemPower methodology for giga-hertz performance
- サポート
- コミュニティ
- 顧客業界をリードするエレクトロニクス企業のために
- パートナーファンドリー、IP、EDA、業界アライアンス
- ブログ
- Chip-Package-Systemグループパワー、ノイズ、信頼性のコンバージェンス
- 会社情報
採用情報
To join our exciting team, please review the open positions below and send your resume to jobs_rd@apache-da.com
Description:
Develop next generation 3D full-wave electromagnetic (EM) solutions for IC package, System-in-Package (SiP), and PCB designs solution.
Qualifications:
- Strong C/C++ programming experience in Windows and Linux
- Minimum 3 years experience in the development of numerical electromagnetic simulation solutions in FEM or MoM
- Familiar with package and PCB modeling and related signal and power integrity issues
- Excellent verbal and written communication skills
- MS. or Ph.D. in Electrical Engineering, Computer Science or other related area
Job ID: APA100116
